Qualcomm announced its flagship chipset in the beginning of December at the Snapdragon Technology Summit. According to the latest leak from Weibo, the chipset company from San Diego is preparing three more SoC platforms for 2018 – Snapdragon 670, Snapdragon 640 and Snapdragon 460.
The SD670 comes as a successor of the SD660. The biggest change is the process it is built on – it will be 10nm so it will be more power-efficient. The CPU will have eight cores – 4x Kryo 360 at 2 GHz and 4x Kryo 385, clocked at 1.6 GHz. The GPU will be Adreno 620 and dual 14-bit Spectra 260 ISP. It will support smartphones with one camera up to 26 MP or a dual setup of 13 MP + 13 MP.
The modem of the Snapdragon 670 is expected to be X16 LTE Cat.16 with a maximum download speed of 1 Gbps and upload speed of 150 Mbps. This chipset might be targeted at upper midrange phones but with such specs, it might act as a sub-flagship platform.
The CPU of the lower tier Snapdragon 640, will have 2 powerful Kryo 360 cores at 2.15 GHz and six more at 1.55 GHz. GPU will be Adreno 610, but the ISP will be the same as in the 670. The modem is listed as X12 LTE with up to 600/150 download/upload speed.
Snapdragon 460 is sharing the same modem as the 640. Most likely aimed to power the most affordable smartphones, the CPU of the 460 has eight Kryo 360 cores – four at 1.8 GHz and four at 1.4 GHz. The memory has no system cache and the camera could be up to 21 MP with a Spectra 240 ISP. Unlike the other two, this chipset will be built on the 14 nm process technology.
Source (in Chinese) | Via